? semiconductor components industries, llc, 2014 march, 2014 ? rev. 1 publication order number: bas21m3/d 1 bas21m3t5g high voltage switching diode the bas21m3t5g device is a spin ? off of our popular sot ? 23 three ? leaded device. it is designed for high voltage switching applications and is housed in the sot ? 723 surface mount package. this device is ideal for low ? power surface mount applications where board space is at a premium. features ? reduces board space ? this is a halide ? free device ? nsv prefix for automotive and other applications requiring unique site and control change requirements; aec ? q101 qualified and ppap capable ? these are pb ? free devices maximum ratings (each diode) rating symbol value unit reverse voltage v r 250 vdc forward current i f 200 madc peak forward surge current i fm(surge) 625 madc thermal characteristics characteristic symbol max unit total device dissipation fr ? 5 board (note 1) t a = 25 c derate above 25 c p d 265 2.1 mw mw/ c thermal resistance, junction ? to ? ambient r ja 470 c/w total device dissipation alumina substrate, (note 2) t a = 25 c derate above 25 c p d 640 5.1 mw mw/ c thermal resistance, junction ? to ? ambient r ja 195 c/w junction and storage temperature t j , t stg ? 55 to +150 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. fr ? 5 = 1.0 0.75 0.062 in. 2. alumina = 0.4 0.3 0.024 in. 99.5% alumina. 250 v high voltage switching diode device package shipping ? ordering information bas21m3t5g sot ? 723 (pb ? free) 8000 / tape & reel sot ? 723 case 631aa style 2 marking diagram http://onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. am = specific device code m = date code am m 1 3 2 1 3 cathode 1 anode NSVBAS21M3T5G sot ? 723 (pb ? free) 8000 / tape & reel
bas21m3t5g http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min max unit reverse voltage leakage current (v r = 200 vdc) (v r = 200 vdc, t j = 150 c) i r ? ? 0.1 100 adc reverse breakdown voltage (i br = 100 adc) v (br) 250 ? vdc forward voltage (i f = 100 madc) (i f = 200 madc) v f ? ? 1.0 1.25 vdc diode capacitance (v r = 0, f = 1.0 mhz) c d ? 5.0 pf reverse recovery time (i f = i r = 30 madc, i r(rec) = 3.0 madc, r l = 100) t rr ? 50 ns product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. notes: 1. a 2.0 k variable resistor adjusted for a forward current (i f ) of 30 ma. notes: 2. input pulse is adjusted so i r(peak) is equal to 30 ma. notes: 3. t p ? t rr +10 v 2.0 k 820 0.1 f d.u.t. v r 100 h 0.1 f 50 output pulse generator 50 input sampling oscilloscope t r t p t 10% 90% i f i r t rr t i r(rec) = 3.0 ma output pulse (i f = i r = 30 ma; measured at i r(rec) = 3.0 ma) i f input signal figure 1. recovery time equivalent test circuit
bas21m3t5g http://onsemi.com 3 typical characteristics v f , forward voltage (v) 0.1 10 20 v r , reverse voltage (v) 1.0 0.1 0.01 0.001 50 80 110 140 170 1.6 0 v r , reverse voltage (v) 1.4 1.0 0.6 0.4 c d , diode capacitance (pf) 246 8 i f , forward current (ma) figure 2. v f vs. i f figure 3. i r vs. v r figure 4. capacitance i r , reverse current ( a) 1.0 10 100 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 85 c 55 c 150 c 125 c 25 c -55 c 200 230 0.8 1.2 1357 cap -40 c 260 150 c 125 c 85 c 55 c 25 c
bas21m3t5g http://onsemi.com 4 package dimensions sot ? 723 case 631aa issue d style 2: pin 1. anode 2. n/c 3. cathode dim min nom max millimeters a 0.45 0.50 0.55 b 0.15 0.21 0.27 b1 0.25 0.31 0.37 c 0.07 0.12 0.17 d 1.15 1.20 1.25 e 0.75 0.80 0.85 e 0.40 bsc h 1.15 1.20 1.25 l e notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of base material. 4. dimensions d and e do not include mold flash, protrusions or gate burrs. d b1 e b e a l c h ? y ? ? x ? x 0.08 y 2x e 1 2 3 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* l2 0.15 0.20 0.25 0.29 ref 3x l2 3x 1 2x top view bottom view side view recommended dimensions: millimeters 0.40 1.50 2x package outline 0.27 2x 0.52 3x 0.36 on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 bas21m3/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
|
